| 摘要 |
PURPOSE:To obtain an AlN substrate having the excellent adhesive strength of a metallic layer and AlN by bonding the AlN substrate having a large quantity of a binder with the surface of a normal AlN substrate, blowing off the binder on sintering and forming irregularities to the surface of the AlN substrate. CONSTITUTION:A plurality of aluminum nitride (AlN) green sheets 1 are laminated, and molded, de-binder treated and baked at a high temperature, thus manufacturing an AlN substrate. A green sheet 2, wherein the ratio of the occupying of AlN powder is brought to 2-70wt.%, is prepared at that time, and the sheets 2 are positioned on one surface or both surfaces of the outermost layer of the AlN substrate, and pre-baked and a binder is removed. Irregularities are shaped to the surface through baking at the high temperature. Accordingly, the AlN substrate having the excellent adhesive strength of a metallic layer and AlN is acquired. |
