| 摘要 |
<p>PURPOSE:To manufacture various packages having excellent heat-dissipating properties and high reliability by using an aluminum nitride substrate capable of forming a multilayer substrate through a green sheet method as a package base and mounting and sealing a cap composed of aluminum nitride or mullite onto the base by a sealing medium. CONSTITUTION:A package 1 consists of AlN, AlN powder is kneaded with a liquefied binder, CaCO3, etc., and a green sheet is manufactured, and a required number of the green sheets are superposed, and contact-bonded and sintered. Through-holes are bored to the green sheets by a press, patterns are printed, and internal wirings 2 conducting superposition sintering can be shaped. Multilayer thin-film circuits are formed by an insulating layer 3A and thin-film conductors 3B on the surface of a base 1 in a thin-film multilayer interconnection 3. An AlN film and a polyimide synthetic resin may also be used as the insulating layer 3A, but it is preferable that thin film diamond through a vapor phase method is employed. A cap made up of AlN or mullite is fitted, thus eliminating the need for a water cooling jacket on the cap.</p> |
