| 摘要 |
Decoupling capacitance is provided with negligible inductance in a high speed discrete wire logic panel by the use of SMT (surface mounting) capacitors that are mounted in holes in the circuit board. A hole is formed in the circuit board under each location where a dual-in-line IC (integrated circuit) is to be mounted, and an SMT capacitor is mounted in the hole, with the opposite terminals of the capacitor soldered to the conductive layers on opposite board surfaces. Each quantity of solder extends substantially in the plane of a corresponding conductive layer. Only one side of each capacitor terminal is soldered to a conductive layer, to permit flux washout. In the PGA (pin grid array) area of the circuit board, a capacitor is selectively mounted under an IC by removing a pin from a hole lying under the pin-free area in the center of the IC, and installing a capacitor in the hole.
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