Mounting for printed circuits forming a heat sink with controlled expansion

摘要

A mounting that forms a heat sink for printed circuit boards comprising a graphite core oriented by compression to obtain very high lateral thermal conductivity and relatively low density is disclosed. This core is held by two outer skins made up of folds of carbon fibers embedded in an epoxy resin matrix. A metallic frame made of invar makes the mounting rigid, thus giving mountings that conduct heat very well while at the same time being light.