发明名称 |
Soldered structure of fine wire, and method of and apparatus for soldering fine wire |
摘要 |
A fine wire whose conductor has a diameter of 100 mu m or less is welded on a conductor pattern. A part of the fine wire is formed into an exposed joint portion which is exposed out of a solder, but a part thereof which is nearer to an electric component than the exposed joint portion is buried in the solder layer.
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申请公布号 |
US4877936(A) |
申请公布日期 |
1989.10.31 |
申请号 |
US19870109166 |
申请日期 |
1987.10.16 |
申请人 |
HITACHI, LTD. |
发明人 |
KOBAYASHI, JYUNICHI |
分类号 |
B23K1/00;H01R43/02;H05K1/18;H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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