| 发明名称 |
PROCESS FOR METALIZING NON-CONDUCTIVE SUBSTRATES |
| 摘要 |
<p>Non-conductive surfaces, particularly through-hole surfaces in double-sided or multi-layer printed circuit board, axe treated (conditioned) to receive void-free, adherent electroless metal coatings by contact of the surfaces with an organosilane preparatory to catalyzation and metallization.</p> |
| 申请公布号 |
CA1262517(A) |
申请公布日期 |
1989.10.31 |
| 申请号 |
CA19870545014 |
申请日期 |
1987.08.20 |
| 申请人 |
MACDERMID, INCORPORATED |
发明人 |
BACH, WOLF;KUKANSKIS, PETER E.;SENECHAL, MARY J.;FERRIER, DONALD R.;WILLIAMS, ANN S. |
| 分类号 |
H05K3/18;C23C18/16;C23C18/18;C23C18/20;C23C18/26;C23C18/28;C23C18/31;C23C18/38;C23C18/40;C23C18/54;H05K3/38;H05K3/42;(IPC1-7):C23C18/20;C23C18/30 |
主分类号 |
H05K3/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
