| 摘要 |
PURPOSE:To obtain a resin composition suitable as parts of electronic and electrical devices, etc., having excellent heat resistance, impact resistance, flame retardance, etc., by blending a resin mixture comprising a specific heat-resistant resin, etc., with a bromine-containing compound and a vinyltrialkoxysilane. CONSTITUTION:100 pts.wt. total amounts of (A) one or more heat-resistant resins selected from a group consisting of a copolymer of a styrenic compound and an imide-based compound of an alpha,betaunsaturated dicarboxylic acid and (B) one or more thermoplastic resin selected from impact-resistant resins obtained by subjecting butadiene rubber, ethylene-propylene rubber or acrylic acid ester- rubber to graft copolymerization with styrene, acrylonitrile or styrene and methyl methacrylate are blended with (C) 0.5-10 pts.wt. antimony oxide, (D) 5-40 pts. wt. bromine-containing compound shown by the formula (n is 1-100) and (E) 0.1-5 pts.wt. vinyltrialkoxysilane. |
