| 摘要 |
<p>PURPOSE:To prevent damage of a dicing blade decreasing its chipping by chamfering the dicing blade in its main unit peripheral edge part so as to decrease grinding resistance in this main unit peripheral edge part. CONSTITUTION:A dicing blade main unit 11 is tilted by an angle theta with respect to a moving direction of a semiconductor wafer 13, and it is ground under this condition by a dicing blade, forming a dicing cut groove. Here the dicing blade main unit 11, applying chamfering to its peripheral edge part, forms a curved surface 12. Thus in the beginning of replacement of the dicing blade, its grinding resistance (f), applied to this main unit peripheral edge part, is reduced, and the dicing blade decreases its chipping. As the result, the dicing blade main unit 1 can be prevented from being damaged.</p> |
