| 摘要 |
PURPOSE:To substantially reduce a washing time after the primary work decreasing a chevron-shaped residual abrasive grain by decreasing width of a cutting dummy material on a work table to 80% or less the width of a workpiece, in case of slicing a wafer. CONSTITUTION:A workpiece 1 is fixed onto a work table 3 through a cushioning cutting dummy material 2, when the workpiece 1 is sliced by a wire saw, width W of the cutting dummy material 2 in its wire through line direction is set to 80% or less the width W' of the workpiece 1. Thus narrowing spreading of a residual abrasive grain 4 in its crest foot, because even a residual amount decreases, a time for shower washing 5 is substantially reduced. Further by sufficiently performing primary washing, a wire, when it is drawn out, suppresses generation of a flaw in a cut surface, and a product of excellent surface accuracy is obtained. |
