| 摘要 |
PURPOSE:To prevent the application of excessive pressure and to enable to remove the trouble caused by the excessive voltage being applied on a conductive bump by a method wherein a spacer, consisting of a photosensitive resin, is interposed between a semiconductor chip and a substrate. CONSTITUTION:Spacers 6, which were formed on the circumferential part of the surface of the semiconductor chip 1, are interposed between the semiconductor chip 1 and the substrate 4. These spacers 6 are consisted of photosensitive resin, and they are formed in such a manner that photosensitive resin, such as spinner and the like, is applied on the surface of the semiconductor substrate 1 in the prescribed thickness and then a patterning is performed using an ordinary photo exposing method. The spacers 6, consisting of photosensitive resin, can be easily formed with the prescribed thickness by regulating the spinner speed and the viscosity and the like of the photosensitive resin when it is applied thereon. |
