| 摘要 |
<p>PURPOSE:To make enlargement ratio optionally variable in both the X and Y directions of a wafer by sticking at least two sheets of strips of third self-adhesive sheets to both sides of first and second self-adhesive sheets and enlarging the first adhesive sheet by enlarging the second and the third adhesive sheets. CONSTITUTION:To widen slits 5 of a wafer, the enlargement ratio in the X direction must be raised. For this reason, four sheets of strip-shaped third self-adhesive sheets 10 are moved to the X axis and sticked almost symmetrically and radially with regard to the X axis and Y axis. And when the overlapping part of the second the third self-adhesive sheets 6 and 10 are pressed and enlarged with an enlarging jig, the enlargement of the first adhesive sheet 2 becomes larger in the X direction than in the Y direction and the wafer is enlarged in ellipse. The enlargement ratio in the X and Y directions can be changed optionally by the sticking position or the number of the third adhesive sheets 10. Hereby, the enlargement ratio in the X and Y directions of the wafer can be changed optionally.</p> |
