| 摘要 |
PURPOSE:To obtain a two sides printed circuit board which is excellent in high frequency characteristics, and has uniform through hold plating free from voids, and is superior to connection reliability between circuits on both sides, by a method wherein, in the case of through hole plating, alkali treatment is previously performed prior to catalyst imparting. CONSTITUTION:Lamination is performed by a constitution containing at least a silane modified polyethylene crosslinking sheet or film, and a silanole condensation catalyst-containing epoxy resine prepreg. At the time of through hole plating for a polyethylene copper-clad laminate formed in a body by heating and pressurizing, alkali treatment is previously performed prior to catalyst imparting. Thereby, uniform through hole plating free from voids can be formed in the polyethylene copper-clad laminate which is excellent in high frequency characteristics such as low permittivity and low dielectric lose, and can be supplied at a low cost. |
