| 摘要 |
PURPOSE:To prevent the occurrence of cracks in a hole boring process and the corrosion of a circuit due to penetration of a plating solution into the cracks and improve a board in acid resistance so as to improve the board in reliability by a method wherein an interconnection board is formed into one piece in such a manner that outer layer materials are provided to an inner layer material interposing resin impregnated base materials between the outer layer materials and the upside and underside of the inner layer material respectively, where the resin layers in contact with the inner layer material are made uncured resin layers. CONSTITUTION:Circuits 2 formed of a metal foil of copper or the like are provided to the upside and underside of an inner layer material 1, and resin impregnated materials 3 are provided to the upside and underside of the inner layer material 1 provided with the circuits 2. In this process, an uncured resin layer 5 of epoxy resin or the like is provided to the face of a base material 4 formed of such as glass cloth or the like contacted with the inner layer material 1. Thereby, the uncured resin layer 5 is interposed between the inner material 1 and the base material 4 at the interface of the resin impregnated base material 3 contacted with the inner layer material 1. By these processes, curing and crosslinking density of the resin is controlled to enable the uncured resin layer 5 to alleviate the shock at a hole boring process by a drill or the like through a stress relaxation, and the separation between the circuits 2 section of the inner layer material 1 and the resin-impregnated base material 3 and the occurrence of cracks are prevented from occurring. The corrosion of the circuits 2 due to penetration of a plating solution can be also restrained. |
