| 摘要 |
PURPOSE:To stabilize the environment conditions around a semiconductor element before molding by covering the semiconductor element a feeding device and the whole of a mold press device and releasing device with a cover, providing partitions and transfer openings between respective devices and feeding clean air into chambers accommodating the feeding devices. CONSTITUTION:A feeding device 3, a mold press device 4 and a releasing device 5 are divided with partitions 2 in a cover 1. Transfer openings 33 and 37 are formed on the patitions 2, while clean air is fed constantly from an air feeding opening 42. The air in a first chamber 28 flows from a space at the upper section of a loader 10 into a second chamber 29, and further flows from an opening 45 close to a resin transfer device 12 into a third chamber 30. As said third chamber 30 communicates with an exhaust trunking 43 for preventing dust generated by resin feeding device 11, the internal pressure of said chamber is lower than that of the second chamber 29, and thus the air flow from the third chamber 30 into the second chamber 29 is not generated and the air in the second chamber 29 is not contaminated. |
