发明名称 ELECTRICALLY SEMICONDUCTIVE HIGH POLYMER MATERIAL COMPOSITION
摘要 PURPOSE:To obtain an electrically semiconductive composition, containing good electrically conductive material powder having a specific volume resistivity and hydrophobized particles of electrically conductive zinc in an insulating high polymer molding material and capable of forming developing rolls, etc., with homogeneous volume resistivity. CONSTITUTION:An electrically semiconductive composition obtained by blending (A) good electrically conductive material powder (e.g., carbon or graphite powder) having 10<-6>-10<-1>OMEGA.cm volume resistivity and preferably <=1mum particle diameter with (B) hydrophobized particles of electrically conductive zinc, prepared by adding a treating agent consisting essentially of Al to zinc oxide powder, stirring, heat-treating the resultant mixture and treating the surface of the resultant electrically conductive ZnO with a titanate based coupling agent or fatty acid based compound and having 10<1>-10<4>OMEGA.cm volume resistivity and preferably 0.1-3mum particle diameter at ratios (wt.%) satisfying formulas I-IV in an insulating high polymer molding material (preferably phenolic resin).
申请公布号 JPH01268760(A) 申请公布日期 1989.10.26
申请号 JP19880097568 申请日期 1988.04.19
申请人 TOKAI RUBBER IND LTD 发明人 NAGANO ETSUKO;HORIO YUKINOBU
分类号 G03G15/08;C08K3/00;C08K3/02;C08K3/10;C08K9/04;C08K13/08;C08L101/00;H01B1/20 主分类号 G03G15/08
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