发明名称 CURABLE COMPOSITION CONTAINING AN EPOXY RESIN, AN IMIDAZOLIDE AND A POLYSULFONIC RESIN
摘要 <p>1. A storage-stable, heat-curable mixture containing a) 100 parts by weight of an epoxy resin, b) 3 to 15 parts by weight of an imidazolide of the formula I see diagramm : EP0194232,P12,F1 wherein R**1 , R**2 and R**3 independently of one another are hydrogen, C1 -C12 alkyl, C5 -C10 cycloalkyl or C6 -C10 aryl and R**4 to R**8 independently of one another are hydrogen, C1 -C12 alkyl, halogen, nitro or trifluoromethyl, where the substituents R**4 and R**8 are not simultaneously hydrogen, and c) 2 to 50 parts by weight of a thermoplastic polysulfone with an average molecular weight of at least 10 000.</p>
申请公布号 DE3665723(D1) 申请公布日期 1989.10.26
申请号 DE19863665723 申请日期 1986.03.03
申请人 CIBA-GEIGY AG 发明人 SCHMID, ROLF, DR.;STAUFFER, WERNER;BOSSHARD, CHRISTIAN, DR.;FISCHER, MICHAEL, DR.
分类号 C08G59/00;C08G59/40;C08G59/50;C08L63/00;(IPC1-7):C08L63/00;C08G59/54 主分类号 C08G59/00
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