ELECTROLESS COPPER PLATING BATH AND PLATING METHOD USING SUCH BATH

摘要

The electroless copper plating bath having improved stability contains a cationic polymer from acrylamide and/or methacrylamide. The plating bath also contains essentially a cupric ion source, a reducing agent for the cupric ion source, and a complexing agent for the cupric ion. A substrate to be plated is contacted with the plating bath maintained preferably at a temperature in the range between about 70 DEG C and about 80 DEG C.