发明名称 CHIP LIFTING ELEMENT
摘要 <p>PURPOSE:To prevent the damage accident of a chip due to a chip plunge-up and to improve its throughput by providing an upper surface formed of a flat surface formed with a through hole for vacuum sucking the chip so that the pin can be telescopic and an oblique surface disposed adjacent to the flat part to move down toward the outer peripheral edge. CONSTITUTION:The upper face of the head 3 of a chip plunge-up element 1 is abutted against the lower face of an adhesive tape 30 onto which chips 25 adhere. One chip is so positioned as to place on the flat surface. The diameter of the flat surface is equal to or slightly larger than the length of the chip. When thus positioned, the adjacent chips are all placed on an oblique surface. Then, the chip placed on the flat surface and the chip placed on the oblique surface are opened at the upper parts 32 of their cutting seam. Thus, in case of the plunge-up, an accident in which the upper ends of the chips collide to cause them to crack is prevented. It is preferable that the diameter of the head 3 is approx. 3 times as large as the length of the chip. The angle theta of the oblique surface is approximately 0.1-5 deg., preferably 0.5-3 deg. and particularly preferably 1-1.5 deg..</p>
申请公布号 JPH01268147(A) 申请公布日期 1989.10.25
申请号 JP19880097419 申请日期 1988.04.20
申请人 HITACHI ELECTRON ENG CO LTD 发明人 UNO MASAO;KODAMA MASAYOSHI;NISHIZUKA TOSHITAKA
分类号 B28D1/30;H01L21/301;H01L21/67;H01L21/673;H01L21/68;H01L21/78 主分类号 B28D1/30
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