发明名称 |
METHOD FOR MAKING AN ADHESION CONTACT |
摘要 |
A method for producing adhesive contacting of an IC on a substrate of a LC cell, comprising suspending the leads of the IC, in the opening of an insulating frame by means of the leads surrounding the leads with conductive adhesive and adhesively securing them on the substrate by means of the frame. |
申请公布号 |
EP0219659(B1) |
申请公布日期 |
1989.10.25 |
申请号 |
EP19860111977 |
申请日期 |
1986.08.29 |
申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
FAHRENSCHON, KURT |
分类号 |
H01L21/52;G02F1/1345;H01L21/58;H01L21/60;H01L23/498;H05K3/32 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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