| 摘要 |
PURPOSE:To improve the workability in heating, compressing and bonding steps which are bottlenecks in a die stamping method and to make it possible to improve production efficiency, by sticking a metal foils and the like to a sheet of parting paper through an adhesive layer, making the parting paper remain, performing rapping in a specified conductor circuit pattern, peeling an unnecessary part, and thereafter bonding the foil on the substrate to which a bonding layer is applied and formed. CONSTITUTION:A conductor plate 1 comprising a metal foil, a resin sheet incorporating carbon or the like is stuck to a sheet of parting paper 3 through an adhesive layer 2, and a base material is formed. Then, the parting paper 3 of said base material is made to remain and rapping is performed into a specified conductor circuit pattern with a metal mold 6. An unnecessary part is peeled off. The specified conductor circuit 1 is formed on the parting paper 3. Then, said step part is inverted and bonded on a substrate 5 on which a bonding layer 4 is applied and formed. Then, the parting paper 3 remaining on said conductor plate 1 is peeled off. Since the conductor plate is stuck to the parting paper through the adhesive layer, handling in rapping and removal of the unnecessary part after the rapping become easy. Since the conductor plate on which the conductor circuits are formed is transferred on the substrate together with the parting paper, the workability in heating, compressing and bonding steps can be improved. |
