| 摘要 |
<p>PURPOSE:To obviate the exposure of metals which are the cause for corrosion problems, etc., to the surface of an active matrix substrate by utilizing conductive films commonly as the connecting films to be exposed on the surface of the active matrix substrate in addition to picture element electrodes. CONSTITUTION:The junctures 41 of the scanning electrodes 30 and the picture element electrodes 20 of the driving elements 40 of the active matrix substrate 50 having the picture element electrodes 20, the scanning electrodes 30 and the driving elements 40 formed by using semiconductors 12 sandwiched above and below with the conductive films on an insulating substrate 10 are formed of the lower metallic film 11 for the driving elements. An insulating film 14 is coated over the entire surface of the lower metallic film 11 and the driving elements 40 excluding connecting windows 14a-14c and thereafter, the connecting films 42 for the picture element electrodes 20 and both the electrodes of the driving elements 40 are formed of the conductive films 15 consisting of the metal oxide which comes into conductive conduct with the upper and lower metallic films 13, 11. All the surfaces of the active matrix substrate 50 are thereby completely covered with the insulating film 14 and the conductive films 15 and the exposure of the metallic films on the surface is obviated. The possibility that defects are generated by surface corrosion is completely eliminated. In addition, the complication of the production process is averted.</p> |
