| 摘要 |
PURPOSE:To make the operation of a transistor uniform for facilitating the manufacture of a semiconductor device of excellent high frequency characteristic without complicating the wire bonding procedure, by equipping a plurality of pressure welding parts at the tip of a bonding tool and bonding a wire by pressing at a plurality of the parts thereof simultaneously. CONSTITUTION:To perform wire bonding by connecting two or more electrically equipotential bonding pads 25 equipped at a distance to an outside drawing lead 32 corresponding to said bonding pads 25 with a wire 30, a bonding tool 21 having as many pressure welding parts 22 as the bonding pads 25 at the tip thereof is prepared. The wire 30 is bonded to the bonding pads 25 simultaneously by lowering the bonding tool 21 in the first bonding procedure, and to the lead 32 by pressing at as many parts as the pressure welding parts 22 in the second bonding procedure. |
