发明名称 Method for forming a photoresist pattern and apparatus applicable with said method.
摘要 <p>With the method pattern elements with predetermined wall profiles and/or lateral shapes differing from the shapes of the respective pattern elements in the used irradiation mask are formed in a photoresist layer. The method comprises a modification of the conventional photo- lithographic process where a substrate supporting the photoresist layer is shifted laterally relative to the mask or the mask image respectively in a continuous mode and/or in steps during exposure. The apparatus comprises means for shifting a substrate relative to a mask into the x- and/or the y-direction or means between the mask and the substrate to shift the path of the beam relative to the mask and controls for said means. The method - especially in connection with the apparatus - allows to form reproducibly photoresist patterns with a great variety of differently formed wall profiles and/or lateral shapes. Using the method photoresist patterns can be flexibly adapted to many applications.</p>
申请公布号 EP0338110(A1) 申请公布日期 1989.10.25
申请号 EP19880106389 申请日期 1988.04.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BOTTIGER, ULRICH CHRISTOPH;HAFNER, BERNHARD
分类号 G03F7/20;G03F9/00;H01L21/027;H01L21/30 主分类号 G03F7/20
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