| 摘要 |
<p>PURPOSE:To obtain an IC card having a card and an IC module adhered stably to each other and having excellent quality, by providing a projected part on the bottom surface of the IC module. CONSTITUTION:An IC module 12 is fixed in a recessed part 11a by an adhesive 13 which is hardenable at normal or high temperature, and projected parts 14 are integrally molded on the bottom surface of the IC module 12. IC chips are adhered to a base 15 and a frame member 16 of the module 12, wire leads are connected thereto, followed by sealing with an epoxy resin 17, and at the time of hardening the sealing resin 17, the projected parts 14 are molded by a mold (metallic mold or the like). With the projected parts provided on the bottom surface of the module, a pressure is concentrated on the region between the projected parts and the bottom surface of the recessed part at the time of adhering the module, and the adhesive is distributed uniformly, whereby stabilization of adhesion can be contrived, and the module can be prevented from being adhered in an inclined state.</p> |
