| 摘要 |
PURPOSE:To reduce the cost by directly bonding a copper wire to the surface of an inner lead having specified surface roughness to be wire-bonded. CONSTITUTION:The surface of an inner lead portion 5 to be wire bonded has 1 to 40 mum surface roughness, to which surface a copper wire 1 is directly bonded. The roughened surface of the inner lead portion might cause plastic deformation upon bonding with ease and destroy an oxide film, so that satisfactory bonding strength could be assured even with direct bonding without plating. Thus, no plating is required on the inner lead portion to reduce the device cost. |
