| 摘要 |
PURPOSE:To obtain continuously in good productivity epoxy resin tablets for semiconductor sealing, having a high specific gravity and excellent adhesion to semiconductor, etc., by mixing an epoxy resin powder with a specified amount of a silicone lubricant and molding the obtained mixture into tablets. CONSTITUTION:100pts.wt. epoxy resin composition powder (e.g., bisphenol A epoxy resin powder containing a curing agent) is mixed with 0.01-0.5pt.wt. silicone lubricant. As said silicone lubricant, an alpha-olefin-modified silicone or an organopolysiloxane of formula I (wherein Rf is a perfluoroalkyl) is used. It is desirable that the silicone lubricant is previously dissolved in a solvent of a b.p. <=120 deg.C (e.g., silicone of formula II) and mixed with the resin. This mixture is molded to obtain epoxy resin tablets for semiconductor sealing. In this way, it is possible to perform the molding without forming any chippings, crazings, etc. on the surfaces of tablets. |
