| 摘要 |
PURPOSE:To optimize a processing speed in assembling of the title apparatus by unifying into one processing line processes of the assembling where processing speeds are relatively close. CONSTITUTION:The title assembling apparatus comprises first assembling devices 9 to 11 wherein pellet bonding, wire bonding, and resin molding are performed, second assembling devices 12 to 15 wherein deburring, solder coating, washing, and drying are performed, and third assembling devices 16 to 20 wherein measurements, marking, and soating are performed. For measurement of semiconductor devices in the third assembling devices 16 to 20, individual semiconductor devices are cut away from a continuous lead frame 1 leaving behind one lead, and the continuous lead frame 1 is cut down into short-cut sections of given length. The semiconductor device is measured keeping the remaining continuous lead frame 1 separated from the short-cut sections. Hereby, the respective processing speeds of the first through third assembling devices can be designed in an optimum manner. |
