| 摘要 |
PURPOSE:To reduce generation of a crack at the time of boring processing of a through hole, by a method wherein at the time of heating, pressurization and molding of a plurality of metallic sheets provided with through holes and piled up through prepreg, a matter obtained by compounding a plasticizer with a polyimide resin is used as resin to be infiltrated into the prepreg. CONSTITUTION:A plurality of metallic sheets 2 into which through holes 1 are provided are piled up through prepreg 3, the same is heated, pressurized and molded and resin infiltrated into the prepreg 3 is cured. The metallic sheets 2 each are stuck through lamination, the resin infiltrated into the prepreg 3 is flowed into the through holes 1 of the metallic sheets 2 for filling and cured. At the time of performance of boring processing of a through hole 5 at a part of the resin 4 within the through hole 1, a matter obtained by compounding a plasticizer with polyimide is used as resin to be infiltrated into the prepreg 3. Since the resin 4 is of the polyimide resin whose flexibility is improved through compounding of the plasticizer, even if heating stress due to a difference between the coefficients of thermal expansion of the resin 4 and metallic sheet 2 acts upon the resin 4, it is mitigated and generation of a crack on the resin 4 can be reduced. |
