| 摘要 |
PURPOSE:To increase the using efficiency of measuring units and to enhance the processing capacity by a device wherein wafer checking electrodes are dispensed with along at least one side of a semiconductor chip. CONSTITUTION:Wafer checking electrodes are not arranged along one side of a semiconductor chip. Another adjacent semiconductor chip is made on a semiconductor wafer in a 180 deg. rotated relation. When both semiconductor chips are combined, their wafer checking electrodes have such a shape that they are arranged along the periphery of the combined semiconductor chips. Thus, a probe card thereof can be formed easily based on the prior art. By measuring two semiconductor chips at each time with the probe card, it becomes possible to increase the number of wafers checked by a measuring unit and also to ensure more effective use of the measuring unit. This method is also applicable to square semiconductor chips. |
