发明名称 MEASUREMENT OF SEMICONDUCTOR WAFER CHIP
摘要 PURPOSE:To make positioning and characteristic measurement accurate by a method wherein the probes respectively pierce through two cylindrical guide sleeves being positioned by means of a measurement jig making them come into contact with the same electrode. CONSTITUTION:A guide sleeve 21 as a jig comprizing two sleeves formed into one body is pierced by a power supply probe 14 and a measurement probe 18. Another guide sleeve 22 operates in the similar manner as the sleeve 21. Through this constitution, the characteristics may be measured accurately by means of the well known Kelvin process excluding any voltage decline due to contact resistance out of the measurement circuit system and the two probes may be accurately positioned for abutting against an electrode regardless of the narrow space of the electrode abutted against the probes.
申请公布号 JPS58158939(A) 申请公布日期 1983.09.21
申请号 JP19820041062 申请日期 1982.03.16
申请人 NIPPON DENKI KK 发明人 OGAWA YOSHITO
分类号 G01R31/26;G01R1/073;H01L21/66 主分类号 G01R31/26
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