发明名称 POLISHING OF ROTATIVELY SYMMETRICAL ASPHERIC SURFACE
摘要 PURPOSE:To polish a rotatively symmetrical aspheric surface in the desired shape with high precision by determining the voltage to be applied to piezoelectric elements based on the difference between the surface shape of an object to be polished and the preset desired shape when this difference is not within the tolerance and applying this voltage to the piezoelectric elements to create an acting face. CONSTITUTION:The rotatively symmetrical aspheric surface 1a of an object to be polished is polished by a polishing tool 3 stored with multiple piezoelectric elements 5 while one end side is fixed to a tool holder and the other end side is brought into contact with a flexible plate in a hollow tool main body 3b, with its acting face formed with the flexible plate. The surface shape of the object to be polished is measured by a measuring device 6, this measured value is compared with the preset desired shape. The voltage to be applied to each piezoelectric element of the polishing tool is calculated by a calculating device 8 based on this compared value, this voltage is applied to each piezoelectric element to generate the preset size change, the shape of the flexible plate in contact with it is locally corrected for polishing. The surface shape of the object to be polished 1 is again measured, this operation is repeated.
申请公布号 JPH01264757(A) 申请公布日期 1989.10.23
申请号 JP19880093406 申请日期 1988.04.18
申请人 HITACHI LTD 发明人 KAWAI TSUNEO;FUJISAWA MASAYASU
分类号 B24B13/04;B23Q1/03;B23Q1/34;B24B13/00;B24B13/06 主分类号 B24B13/04
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