发明名称 CHIP ELECTRONIC PARTS SERIES
摘要 <p>PURPOSE:To obviate a sub-material for taping and obviate a taping process by forming an electrical material film on a base material across both terminal electrodes between terminal electrode pair formed at a fixed pitch in the longitudinal direction of a tape-like base material. CONSTITUTION:A base material 11, made of a resin material having insulation and flexibility, has projection pieces 15a and 15b protruding at a fixed pitch from both side edges 11a, 11b along their longitudinal direction. Projection pieces 15a and 15b are respectively formed with terminal electrodes 12a and 12b. A resistance material film 14 is formed on the base material 11 so as to bridge the terminal electrodes 12a and 12b. The resistance material film 14 is formed in such a way that each end thereof is overlapped on each plating electrode film 16 and further part of each external electrode film 17 is overlapped on each end of the resistance material film 14. Then, chip resistors 9 connected in series are formed at a fixed pitch in the longitudinal direction of the tape-like base material 11.</p>
申请公布号 JPH01264204(A) 申请公布日期 1989.10.20
申请号 JP19880094241 申请日期 1988.04.14
申请人 MURATA MFG CO LTD 发明人 TANAKA SHIGEAKI
分类号 B65D73/02;H01C13/02;H01C17/00;H01G13/00;H05K13/02 主分类号 B65D73/02
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