| 摘要 |
PURPOSE: To compensate for the difference of the coefficient of thermal expansion between a chip holder (LCCC) and a board by bonding a nonconductive film to the LCCC at a plurality of points spaced apart from each other. CONSTITUTION: Interval and arrangement of respective conductors on an adaptor 40 are determined such that these conductors are aligned with individual corresponding conductors on a printed wiring board(PWB) 12. Conductors 20 on the PWB 12 are aligned with 54 on a region 46. A film 42 of the adapter 40 is bonded to the surface 22 of the PWB through a plurality of linear epoxy adhesion beads 61, 62, 64 and 66. Dimensions of the adapter 40 are determined such that the adapter slacks slightly after formation of epoxy beads and a slightly bent or curved part is formed. When an assembly thus formed is subjected to temperature variation, a flexible landing part formed by the adapter 40 acts to isolate the solder joint 70 of an LCCC 14 from strain and stress caused by the difference of the coefficient of thermal expansion between the PWB 12 and the LCCC 14. |
