| 摘要 |
<p>PURPOSE:To shorten a testing time, by a method wherein a plurality of test terminals connected to an IC chip mounted in an IC module are disposed in the state of being exposed on an outer surface of the module, and components of the IC chip are directly tested. CONSTITUTION:Eight external communication terminals 6 and a plurality of test terminals 7 are provided in the state of being exposed on an outer surface of a tape carrier 8. The communication terminals 6 and the test terminals 7 are arranged along the four sides of the periphery of a central rectangular space 9 of the tape carrier 8. The terminals 6, 7 are composed of belt-shaped conductors, which are electrically insulated from each other. The terminals 6, 7 and a pad provided on the surface of an IC chip 10 are connected to each other by bumps 11, which are covered by a sealing material 14. The tape carrier 8, the IC chip 10 and the like are covered and hermetically sealed by an insulating part 20 consisting of a resin or the like. The terminals 7, 6 are left exposed. Therefore, all components in the IC chip can be tested in a short time.</p> |
