| 摘要 |
PURPOSE:To seal an IC by a thermoplastic resin by projecting sliding pins, which are set into an upper cavity and a lower cavity and can be projected and retreated at specified strokes, only by the quantity of setting by resilient force and holding an inserted IC chip by the sliding pins under the state in which a die is closed. CONSTITUTION:An IC chip 1 is held by sliding pins 2 projected by springs 4 from the top force 6 side and sliding pins 3 projected by springs 4 from the bottom force 5 side, and the position of an attitude is fixed in the space of a cavity 11. When the inside of the cavity 11 is filled with a molten sealing medium through a sprue 10 and filling pressuring force is applied, the sliding pins 2 and the sliding pins 3 are pushed in. The IC chip 1 is maintained by the sliding pins 2 and the sliding pins 3 during a time when filling applied force is applied. |
