发明名称 DIODE DEVICE PACKAGING ARRANGEMENT
摘要 <p>An arrangement for packaging an active millimeter wave device is provided having an active solid state diode (18) mounted on a cylindrical shaped heat sink pedestal (12). The cap (24) for the diode is an elongated cylindrical conductor which also serves as a portion of the center coaxial conductor and DC bias pin. A conductive annular ring (28) is also mounted on the pedestal encircling the diode and serves as the outer coaxial conductor for the coaxial transmission line structure. Advantageously the coaxial transmission line, namely the center and outer conductors, can be precisely assembled in relation to the diode for improved impedance characteristic and efficient energy coupling. Furthermore, the elongated cap (24) moves the point of contact with the bias pin (36) to a region of higher RF impedance, reducing RF losses.</p>
申请公布号 WO1989010006(A1) 申请公布日期 1989.10.19
申请号 US1989000858 申请日期 1989.03.06
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