ELECTRONIC CIRCUIT BOARD STRUCTURE

摘要

PURPOSE: To provide a low stress flat base to be interconnected with a board by providing a structure for taking out an external connection with a conductive via of the board through a surface hermetic seal layer composed of a material different from that of the board. CONSTITUTION: An upper layer 19 is bonded to the surface of a board including a metal feature part 14 to be sintered simultaneously. The metal feature part 14 is bonded not only as a coupling pad 16 to be coupled later but also as a 'capturing pad' for sealing the periphery of a via itself. The capturing pad on the surface has diameter significantly larger than the diameter at the inner metal feature part on the underside and a large target is provided for subsequent interconnection. The hermetic seal layer can release stress required for coupling a pin or a device without applying an undue stress to a package.