发明名称 PATTERN PLATING METHOD
摘要 PURPOSE:To easily plate various high-quality patterns by attaching a screen not reacting with a plating solvent and having a pattern closely to the surface of a material to be treated, and applying the plating solvent converted to a paste thereon. CONSTITUTION:A patterned screen 2 for plating not reacting with a plating solvent is closely attached to the surface of a material 1 to be treated by using a fixing frame 3, etc. The plating solvent 4 converted to a paste is applied on the screen 2. The applied solvent 4 is brought into contact with the material 1 only at the part 2a of the pattern of the screen 2, and a plating layer 8 corresponding to the pattern of the screen 2 is formed on the surface of the material 1. When electroplating is applied by using the material 1 as a cathode and providing an electrode (anode) on the surface coated with the solvent 4, a high- quality patterned plating can be formed.
申请公布号 JPH01263293(A) 申请公布日期 1989.10.19
申请号 JP19880092513 申请日期 1988.04.14
申请人 KAWASAKI STEEL CORP 发明人 TOTSUKA NOBUO;KURISU TAKAO
分类号 C23C18/38;C25D5/02;C25D17/00 主分类号 C23C18/38
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