| 摘要 |
PURPOSE:To improve the stability of the title plating soln. and to form a superior plating film by using a cupric salt, a copper complexing agent, alkali hydroxide and a reducing agent as essential components and further adding polyalkylene glycol, a selenium compd., etc. CONSTITUTION:An electroless copper plating soln. is prepd. by using a cupric salt such as copper sulfate, a complexing agent such as tartatic acid, alkali hydroxide and a reducing agent such as formaldehyde as essential components and further adding additives including polyalkylene glycol, one or more among dipyridyl, 1,10-phenanthroline and 2,2'-diquinolyl and a selenium compd. such as selenate. The plating soln. inhibits a self-decomposition reaction, has stability over a long period and can form a plating film having superior smoothness, adhesion and fine luster. |
