| 摘要 |
<p>PURPOSE:To provide an IC card with a beautiful print, by placing and fixing an IC module in a recessed part of a card base, and providing the print and a hard coat on the surface of the card base. CONSTITUTION:A card base 9 is injection-molded from an ABS resin, when a recessed part 9a for storing a board therein and a recessed part 9b for sealing are also molded simultaneously. An adhesive is applied to adherend parts 9d, 9e, namely, bottom surfaces of the recessed parts 9a and 9b of the card base 9, to which a circuit board 11 and a sealing part 13 of an IC module 10 are respectively adhered, followed by heating to hardening the adhesive. Prints 14 are provided on the face and back sides of the card base 9 by offset printing or the like. In this case, since a thinner part 9c of the card base 9 at which the recessed part 13 is provided is supported by the sealing part 13 of the IC module 10, the prints 14 can be provided uniformly on the entire surface of the card base 9. Next, hard coat 15 is provided, and the entire surface of the card base 9 is coated. Finally, an electrostatic treatment is carried out.</p> |
