Housing for hybrid circuits

摘要

A housing for hybrid circuits, especially electronic or optronic thick-film circuits having a protective-gas filling in the space which is surrounded by a cover and is hermetically sealed. The substrate is at the same time the housing base, and the cover can be connected directly to it. The substrate advantageously consists of ceramic and is coated with a metal layer on its outside for electromagnetic screening. A thick-film pattern for populating with monolithically integrated circuits and other components is applied on the side of the substrate facing the interior.