AN ELECTRONIC CHIP CONNECTION ASSEMBLY AND METHOD

摘要

This assembly allows connecting in one operation a plurality of chips (10) to chips and to a substrate (1) or each chip to a substrate, using an elastomeric pressure means (12) that continues to pressure chips having micron sized leads (19) to chip pads (6) on one end and to circuitry (3) on the substrate on the other end, and a metallic cover (11) fastened to the substrate and containing said elastomeric pressure means, the pressure means also including a ribbed projection (16) to hermetically seal the unit so that the substrate itself becomes an integral part of the assembly package.