| 摘要 |
<p>PURPOSE:To enable easy formation of an adhesive-containing groove for preventing an adhesive for mounting an IC module on a card base from flowing out via a plated-through hole and secure a sufficient adhesion area, by disposing the plated-through holes collectively in a specified region of a board of the IC module. CONSTITUTION:Plated-through holes 14 of an IC module 11 are disposed collectively in specified regions 30 of a board 12, and external terminals 13 provided on the board 12 are provided in the form of a plurality of divided pieces so that they do not make contact with each other. When the IC module 11 is mounted in a recessed part 25 of a card base 20, an adhesive 24 present in the vicinity of the plated-through hole 14 is contained in an adhesive-containing groove 27. Therefore, the adhesive will not enter the plated-through hole 14 to flow out to the side of the terminals 13, so that imperfect contact of the terminals 13 is prevented from occurring. Since the plated-through holes 14 are disposed collectively in the specified regions of the board 12, the adhesive- containing grooves 27 can be easily provided in reduced areas, so that an adhesion area for the IC module 11 can be secured without any reduction.</p> |
