| 摘要 |
PURPOSE:To rotate a wafer at a high speed, keep splashes of a developer from dropping on the wafer again, and thus prevent occurrences of defective patterns caused by the above dropping of the developer on the wafer, by discharging falling solution from supply ports which are provided at the upper parts of a developing cut inner circumferential face. CONSTITUTION:This developing device is composed of: a wafer chuck 1 which rotates itself while holding a wafer after sucking it; a developing cut 3 surrounding the wafer; a nozzle 5 which drops developers G and R on the wafer and then, supply ports 7 of falling solution J are mounted at the upper whole circumferential face of the developing cup. In this way, falling liquid flows down along the inner circumferential face of the cup by supplying falling liquid from the supply ports which are provided at the upper parts of the developing cup to the inner circumferential face and then, the inner face is covered with the falling solution. Thus, the developer reaching the foregoing cup by splashing outwards from an outer circumferential face of the wafer is absorbed by the falling solution and splashes of the developer rebounding on the cup never fall again on the wafer. |
