发明名称 MANUFACTURE OF MULTILAYER INTERCONNECTION BOARD
摘要 PURPOSE:To fill each through hole with an adequate amount of conductive paste and to avoid the attachment of the conductive paste to the stage of a printing apparatus, by printing a wiring pattern on one side surface of a first green sheet, laminating and temporarily compressing a second green sheet thereon, printing a wiring pattern on the upper surface of the laminated green sheet, forming via-holes, and thereafter temporarily compressing another green sheet on the upper part thereof. CONSTITUTION:Wiring patterns L4 and L5 are printed on the surface of a green sheet 2. Then a green sheet 1 is laminated on the printed surface of the green sheet 2 and temporarily compressed. Then the temporarily compressed green sheet is turned over. Wiring patterns L6 and L7 are formed on the surface of the green sheet 2 by screen printing. Thereafter, a green sheet 3 is laminated on the upper part of the green sheet 2 and temporarily compressed. Then, the laminated green sheet is turned over. Conductive paste is printed on the side of the green sheet 1. Wiring patterns L1, L2 and L3 are formed. Through holes H1 and H2 are filled with the conductive paste.
申请公布号 JPH01260889(A) 申请公布日期 1989.10.18
申请号 JP19880089682 申请日期 1988.04.12
申请人 MURATA MFG CO LTD 发明人 MORIMOTO RYOICHI
分类号 H05K3/46 主分类号 H05K3/46
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