| 摘要 |
PURPOSE:To perform solder plating in an excellent state without concentration of electric charge in a long signal pattern, by forming a long, independent signal pattern on a wiring board, forming a dummy pattern in the vicinity of the signal pattern, and applying electric solder plating to both patterns. CONSTITUTION:One more pattern 3 is provided along an independent signal pattern in the vicinity (position without electric effect) of the long, independent signal pattern in a work film. The work film is exposed and developed. On this wiring board 1, copper is electrodeposited by several mum in a copper plating bath. Then solder is electrodeposited thereon by ten and several mum in a solder plating bath. Then, photoresist is removed, and etching is performed. The solder is separated, and a pattern is formed. In said electric solder plating, electric charge concentrated in the independent signal pattern 2 is dispersed to the dummy pattern 3. Therefore, the solder on the independent signal pattern is not burned. Thus, the excellent solder electrodeposition can be expected. |
