| 摘要 |
This invention concerns a bonding composition useful for the manufacture of fully and semi-additive printed wiring boards. The composition comprises a phenolic resin substantially free of methyl ether groups with an average of four to ten phenolic rings per molecule and at least two methylol functional groups; at least one heat resistant polymer with an aromatic or cyclic backbone and functional groups capble of crosslinking with the phenolic methylol groups without evolving water and present in an amount sufficient to react with the methylol groups; and 30 to 60% by weight of an elastomer. The composition is applied and cured on a printed wiring base material. After curing, the composition is capable of being adhesion promoted for adherent electroless metal deposition. The bonding composition is capable of maintaining the bond of the deposited metal for 10 seconds during repair cycles with a soldering iron at 430 DEG C. |
