Selective plating by laser ablation.

摘要

A method is described for the selective plating of a metal substrate on which a thin polymeric plating resist is first applied, followed by the selective removal of said resist to expose portions of said substrate to plating, and plating. More particularly, the method includes the steps of selecting a laser wavelength which couples well to the metal substrate, choosing a polymer based plating resist having a low optical coefficient of absorption at said wavelength, curing said resist, subjecting selective areas of said resist to a single excimer laser shot, having a short wavelength, to cause ablative removal of the resist over the selective areas of said substrate, and subjecting said exposed portions of said substrate to metal plating.