| 发明名称 |
METHOD OF FORMING CONTACTS FOR FLEXIBLE MODULE CARRIERS |
| 摘要 |
<p>Disclosed is a method of fabricating a novel printed circuit structure including a relatively small surface area of flexible material integral with a conventional glass epoxy carrier on which electrical contacts may be formed.</p> |
| 申请公布号 |
EP0147566(B1) |
申请公布日期 |
1989.10.18 |
| 申请号 |
EP19840113003 |
申请日期 |
1984.10.29 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BALDAUF, LAWRENCE MARTIN;GIRVAN, EDWARD JOSEPH;OVERFIELD, RICHARD BLEWER;ROBERTS, GILBERT CHARLES |
| 分类号 |
H01R12/04;H05K1/00;H05K3/00;H05K3/10;H05K3/24;H05K3/34;H05K3/40 |
主分类号 |
H01R12/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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