| 摘要 |
PURPOSE:To form an Ni layer having good adhesion accurately and easily on an Al base plate by coating paste contg. specific ratios of Ni, Ag and Pd on the Al base plate, drying the same and heat-treating the Al base plate at specific temp. then subjecting the base plate to electroless Ni plating. CONSTITUTION:Paste contg. 1-40wt% metallic components consisting of 10- 98.5wt% Ni component, 1-89.5wt% Ag component and 0.01-5wt% Pd component is coated on the required parts of an Al base plate and is dired. The base plate is then heat-treated at 350-600 deg.C to deposit a fine metallic particle layer, whereafter an Ni film layer is formed by electroless Ni plating thereon. Fine Pd particles of about <=2mu particle size or Pd compds. such as PdCl2 are used as the Pd component, fine Ni particles of about <=2mu particle size for the Ni component and fine Ag particles of about <=2mu or compds. such as AgCl for the Ag components. |
